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Test BackEnd (Pack) Process Manager

NXP Semiconductors

Kuala Lumpur permanent

Posted: April 16, 2026

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Quick Summary

The Test BackEnd (Pack) Process Manager leads a team of 14 people, focusing on process optimization, yield improvement, and automated vision coverage. The role requires expertise in quality improvement, automation, and process simplification, with a strong background in mechanical engineering and vision. The ideal candidate should have excellent project management skills and a strong ability to drive visual improvements and eliminate manual inspection processes.

Job Description

1. This role leads process engineering team ( 6 engineers + 8 DL), and work closely with manufacturing, equipment, quality. 
2. Lead process optimization, improve yield, re-scan rate reduction as part of scanner OEE improvement, LOH generation reduction.
3. Vision SME, Drive visual mechanical improvement, drive automated vision coverage per outgoing, and work on manual inspection elimination.
4. Collaborate with equipment and vendor for vision enhancement, covering from 0.5mils crack & OCR implementation.
5. Lead low tech quality improvement, process simplification, poka yoke detection as last gate of operation before customer.
6. Ensure compliance with SOP, customer, and industry standard. Drive zero non-compliance issue during internal GMA audits, IAFT audits and various customer audits.
7. One of key leads for STM's various projects including label, packing methods, knowledge transfer in order to meet ST requirement and ensure smoonth transition.
8. Support NPI and transferred devices qual, ensure resources alignment betwn NPI and operational improvement task.
9. One of the important key stakeholder in automation implementation,  derive risk during process mapping and FMEA, collaborate with automation team with vendor strategy, IT requirement.
10. Lead & mentor process engineering team, set KPIs and drive team performance. 

Qualifications

• BSc or greater in Mechanical, E&E, Mechatronics, Electrical Engineering, Mechanical, Chemical Engineering or related subject.
• Minimum 5 years working in semiconductor manufacturing, preferably relatable in process engineering.
• Posses vision  system, relatable automation technical knowledge.
• Be very structured and methodical on developing and meeting plans and schedules, Green belt / Black Belt preferred.
• Have strong knowledge and experience in project management, continuous improvement, process optimization. 
• Skills in Quality tools including FMEA/CP/SPC, and able to lead audits (both customer and 3rd party audits)
• High capacity to effectively handle multiple tasks with varying levels of complexity.
• Ability to articulate the complex requirements into simple tasks and roadmaps with ability of prioritization.
• Able to drive and set right expectation. Celebrate for wins, and hold right accountability.

Behaviors

• Ownership, have right mindset and behavior, willing to go extra-mile to win
• Speed of execution and strike for results.
• Cultivates Innovation, generates creative ideas and solutions, adapts quickly to new trends and technologies.
• Collaborates, actively works with others to achieve shared goals, builds trust and resolve conflicts constructively.
• Unstoppable, resilient, and nimble learning  (Demonstrates curiosity and continuous improvement mindset)

More information about NXP in Malaysia...

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