TW_感測器研發_Project Manager – MEMS Packaging Development (ESP2)
BoschGroup
Posted: January 2, 2026
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Quick Summary
We are seeking a Project Manager for our TW_感測器研發_Project Manager – MEMS Packaging Development (ESP2) project in Taipei, Taiwan. The ideal candidate will have experience in managing projects, leading teams, and developing innovative products. Key skills include leadership, communication, and problem-solving.
Required Skills
Job Description
Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to improve quality of life all across the globe. Welcome to Bosch.
 
博世集團於1990 年開始在台灣營運，2006年10月整合台灣地區各事業單位，成立在台事業總部，命名為台灣羅伯特博世股份有限公司。自此即開始為在地客戶提供提升其生活品質的產品與服務。由於我們持續不斷的投資及發展，目前博世在台有三個分公司以及四個研發中心。博世在台提供的產品包含汽車原廠零件、汽車零件售後服務、電動自行車系統、傳動與控制系統、安防通訊系統、熱能產品、電動工具、家電產品以及微機電感測器等。 在台灣，博世同時也致力於履行企業社會責任，長期投入在道路安全、環境保護及社會關懷之重點領域。在2013年，台灣博世展開長期的「博世成就愛」社會公益計畫，並舉辦了數場提倡摩托車道路安全的校園宣導活動，同時也與台灣社會大眾分享了博世低碳最佳範例為環保盡一份心力。 台灣博世身為全球科技與服務之領導廠商博世集團旗下的一員。博世集團的策略性目標是藉由創新實現互聯生活，在全球透過創新及激發熱情的產品與服務，提升人們的生活品質。簡言之，博世期許能「以科技成就生活之美 」。
• Define & drive milestones: Establish major package‐development milestones and ensure on-time delivery through proactive planning, progress tracking, and risk mitigation.
• Design coordination: Coordinate package design and process development for inertial MEMS devices in collaboration with internal engineering teams and external suppliers.
• Process engineering: Develop and optimize assembly processes for inertial MEMS in automotive and consumer-electronics applications.
• Sample build & qualification: Oversee sample manufacturing and process qualification at assembly partners.
• Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering, supply chain, and quality teams.
• Experience: 3–8 years in semiconductor packaging/assembly (LGA, BGA, DFN, WLCSP, SiP).
• Technical expertise: Strong background in semiconductor assembly technologies and materials. Experience in TSV processes and WLSCP device development is a plus.
• Project management: Proven ability in milestone tracking, structured reporting, systematic problem solving, multi-task handling, persistence and customer communication.
• Global teamwork: Demonstrated success in multicultural, international projects.
• Adaptability: Agile in adjusting project plans to evolving technical requirements and customer needs.
• Language & mobility: Excellent English skills (verbal and written). Precise and target group oriented communication. Willingness to travel as required.