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Transport Media and Materials Engineer

Intel Corporation

2 Locations permanent

Posted: March 19, 2026

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Quick Summary

Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics.

Job Description

Job Details:

Job Description:

As a Transport Media and Materials Engineer, you will design and develop shipping packaging solutions for wafer‑level, component‑level, and system‑board products supporting Intel products, foundry services, and warehouse logistics. Your work will include creating new packaging designs, defining requirements, conducting qualification testing, and managing project timelines to meet startup schedules and cost targets.

This role also involves leading pathfinding projects to advance packaging technology, performing materials research on corrugated papers and cushions, and providing consultation on packaging improvements with a focus on cost, quality, and environmental impact.

Expected professional traits:

• Demonstrated problem‑solving abilities and disciplined execution
• Experience collaborating across teams to support innovation and continuous improvement
• Familiarity with reliability acceleration methods and tools
• Strong communication skills and ability to consult on packaging technology challenges
• Proven ability to deliver solutions aligned with customer needs and product roadmaps

This position is not eligible for immigration sponsorship.

Qualifications:

Minimum Qualifications

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, or a related field
• 3+ years of packaging engineering experience (electronics/semiconductor preferred)

The years of experience must include:

• Proficiency with packaging design software and CAD tools
• Knowledge of packaging materials and testing standards (ASTM, ISTA)
• Strong project management and analytical skills

Preferred Qualifications

• Master’s degree in engineering
• Semiconductor packaging experience
• Packaging certifications (CPP, IOPP)
• Six Sigma/Lean manufacturing knowledge

Familiarity with international shipping regulations

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

US, Oregon, Hillsboro

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. 

 

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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