Staff Engineer, Sputter Yield Engineering

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Today’s exceptional challenges require your unique skills. Together, we can build the future of data storage.

The role involves conducting detailed failure analyses on defective sputter media using advanced tools, collaborating with engineering teams to troubleshoot Anelva sputter system yield issues, and leading investigations to identify root causes of defects. It includes performing trend analysis to proactively address yield risks, supporting yield improvement projects using problem-solving methodologies, and generating reports for management. The individual must quickly identify problems, drive improvements in processes and materials, participate in the evaluation of new hardware, and maintain structured documentation of failure analyses and corrective actions, all while demonstrating a solid understanding of technical principles related to their work.

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Conduct detailed failure analysis on defective media using tools such as SEM, EDX, AFM, FIB, etc
• Collaborate with Anelva sputter process and equipment engineering teams to troubleshoot chronic yield issues.
• Lead cross-functional investigations to determine root causes of yield loss or quality defects.
• Perform trend analysis and statistical data mining to proactively identify potential yield risks.
• Support and lead Anelva Sputter Yield improvement projects using 8D, or other problem-solving methodologies.
• Generate reports and present findings to management with clear action plans and timelines.
• Able to identify problems quickly using basic data gathering procedures and analysis.
• Drive improvement initiatives in sputter process parameters, Anelva sputter system settings, and material handling.
• Participate in the qualification and evaluation of new materials or hardware upgrades from a yield standpoint
• Maintain documentation of all FA cases and corrective actions in a structured format.
• Provides basic countermeasures and corrective actions to problems.
• Initiates appropriate actions to minimize or eliminate abnormalities and irregularities.
• Can explain basic technical principles behind the processes/ techniques used at work.
• Displays good working technical knowledge of his/her job.

REQUIRED:

• Bachelor’s Degree or above in Material Science, Physics, Engineering (Mechanical, Electrical, or Chemical), or a related field
• 7–10 years of experience in failure analysis, thin film, or semiconductor manufacturing is a plus.
• Familiar with tools and techniques used in failure/root cause analysis (e.g., SEM, SPC, 5 Whys, FMEA).
• Knowledge of sputtering, vacuum systems, or thin film deposition is an added advantage.
• Proficient with statistical data analysis tools 
• Good proficiency and communication skills in English.
• With high learning aptitude
• Good team player (hungry, humble and smart)

PREFERRED:

• Basic metrology concept and inspection background is an advantage

SKILLS:

• Proficient in JMP /Minitab software analysis and statistical tool.
• Proficient in Windows office and presentation material
• With fundamentals of Six Sigma Approach
• Strong interpersonal, oral and written English skills required to conduct daily activities.

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