Signal Integrity Engineering Intern

Job Details:

Job Description:

Supports customer product enablement and ecosystem adoption of Intel products and solutions. May include assisting customer system integration, validation, and issue resolution as well as creation of technical collateral, customer training, and lifecycle management activities. May also collaborate with internal teams and external partners to ensure platform readiness, smooth product ramps, and support ecosystem enablement for platform solution readiness. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment.
Signal integrity intern in Advanced Packaging Technology and Manufacturing (APTM) organization supporting electrical and optical high speed IO (HSIO) and signal integrity related package technology development, package design, and methodology development.

Specific responsibilities include:
• Development of necessary electrical/optical methodology and metrology core competencies needed for package technology development, design and automation.
• Conduct necessary electrical/optical extraction, analysis, and optimization of the high-speed interfaces to assure package designs meet performance specifications for signaling performance.
• Collaborate with other engineers in the team and help establish a positive team atmosphere promoting growth.

Qualifications:

Candidate must possess the below minimum qualifications to be considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of schoolwork/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

• Must be pursuing a Ph.D. or M.S. in Electrical and Computer Engineering or related field

• 3+ months of educational or industry experience with a focus on applied electromagnetics, power/signal integrity, packaging, microwave engineering, optical device and packaging, RF design or a related area

Preferred Qualifications:

Candidate should have demonstrated experience in the following areas:

• Packaging (2/2.5/3D), interconnects, applied electromagnetics, numerical methods, microwave engineering, optical, RF design, high-speed circuit design, optical devices and components design, simulation and characterization, fiber/waveguide coupling schemes, simulation and characterization.

• Ability to perform electrical/optical SI simulations to verify the signaling performance, design features and novel innovations.

• Circuit analysis and signal and power integrity tools such as Simulation Program with Integrated Circuit Emphasis (SPICE), High Frequency Simulation System (HFSS), Advanced Design System (ADS) and optical simulation tools such as Zemax, Ansys Lumerical, and FRED.

• Lab experience with optical component and link characterization and equipment usage.

• Computer architecture and fundamental scripting skills with tools such as Matlab or AI-assisted scripting.

• Proficiency in circuit theory, transmission line fundamentals and signal processing.

• Strong communication, time management, presentation skills and ability to work with others.

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

US, Oregon, Hillsboro

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $82,000.00-110,900.00 USD 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process. 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.