Senior Metals Deposition Engineer

Job Details:

Job Description:

Shape the Future of Semiconductor Innovation at Intel Foundry 

Organization Overview 

Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. 

Position Summary 

MDCE is seeking a Senior Metals Deposition Engineer to drive world-class process performance and manufacturability for advanced metals deposition modules across Intel's cutting-edge technology nodes (18A, Intel 3, and 12nm). This strategic role bridges Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, ensuring seamless module readiness from early development through full production ramp and ongoing support. 

Key Responsibilities 

Strategic Leadership & Execution 

• Align organizational objectives with technical vision and formulate strategies for cutting-edge solution delivery 
• Execute customer-first initiatives with relentless focus on meeting deadlines and requirements 
• Synthesize diverse inputs to develop strategic responses and drive rapid execution of challenging schedules 

Technical Problem Solving & Collaboration 

• Own resolution of complex technical challenges, integrating solutions across multiple organizational groups (including technology development and high volume manufacturing) 
• Collaborate effectively with Technology Development (TD), manufacturing (TFSM), and Business Groups to achieve common goals 
• Engage internal and external stakeholders including Integration, Device, Yield, Defect Metrology, Quality, Reliability teams, and suppliers 

Team Leadership & Industry Expertise 

• Define team goals, remove obstacles, and ensure timely delivery of process solutions 
• Stay current with industry-leading technologies and direction-setting trends 
• Foster in-person collaboration to accelerate decision-making and problem resolution 
• Take ownership of outcomes and proactively surface and resolve issues 

Soft Skills 

• Mentoring experience and ability to serve as technical focal point 
• Strong ownership mindset with end-to-end problem-solving capabilities 
• Ability to thrive in fast-paced, ambiguous environments while maintaining safety, quality, and compliance standards 

Qualifications:

The Minimum qualifications are required to be initially considered for this position.  Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 

Minimum Qualifications  

• Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related engineering/science field 
• 7+ years of semiconductor manufacturing, process development, or technology development experience 
• 4+ years of direct experience with metals deposition modules 
• Hands on Experience with one or more deposition technologies: (PVD, CVD, and/or ALD technologies for metals, conductive films, or barrier/liner stacks) 
• Experience in process development, optimization, and HVM transfer 
• Previous semiconductor foundry experience 

Preferred Qualifications  

• Doctoral degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related engineering/science field 
• Previous semiconductor foundry experience preferred 
• Experience with advanced technology nodes (10nm and below), particularly Intel 18A, Intel 3, Intel 4/7, or comparable foundry nodes 
• Experience with metals deposition modules including: (Contact/MOL metals (W, Co, Ru, liners/barriers, BEOL/Cu interconnect (Cu/Co/Ru/W, caps, barriers, seed, Advanced liners/barriers/adhesion layers or conductive films) 
• Technology ramp and transfer experience from TD to HVM 
• Supplier collaboration experience for hardware, chamber design, or chemistry improvements 
• Cross-functional leadership experience with task forces for yield improvement and technology ramp 
• Experience in integration and module interactions (e.g. deposition with CMP, lithography, etch, clean) 

Why Join Intel MDCE? 

Intel offers an exceptional opportunity to work with cutting-edge technology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high-volume manufacturing. 

Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader. 

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

US, Arizona, Phoenix

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. 

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.