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Semiconductor Packaging Engineering Intern - Summer 2026

NXP Semiconductors

Austin (Oakhill, Office) permanent

Posted: March 27, 2026

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Quick Summary

Work with packaging engineers to help define and validate packages used for new products for NXP. This role involves collaborating with engineers to create scalable and cost-effective packaging solutions for electronic products. The ideal candidate will have experience in packaging engineering and experience with CAD software.

Job Description

NXP’s Technology (CTO) organization plays an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers.

The Packaging Innovation (PI) organization in CTO is responsible for the implementation of packaging solutions for new product introduction and new technology development for electronic packages for the varied business product lines.

Job Summary:

• Work with packaging engineers to help define and validate packages used for new products for NXP. 
• Potential working in the lab to perform tests and mechanical analysis to evaluate packages and materials used in microelectronic packages.
• Potential working with the design team using CAD to define packages that will be used for new products.   
• Potential working with Package Innovation team modeling package performance (thermal, mechanical, electrical)
• Address and solve design, materials and processing issues that may occur during the development process.

Job Qualifications:

• B.S, M.S. or Ph.D. Candidate in Materials Science, Mechanical Engineering or Electrical Engineering.
• Ability to be a team player with positive attitude, self-driven, with good communication and presentation skills (both written and verbal).
• Willingness to learn new concepts and apply fundamental knowledge to engineering problems. 
• Working knowledge of MS Office tools like PowerPoint, Word, Excel is required.
• Working knowledge of CAD tools and/or Finite Element Simulation tools is a plus.
• Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
• Knowledge of Statistical Data Analysis incl. graphing/plotting and Design of Experiment is a plus.
• Knowledge of soldering and intermetallic compounds is a plus.

In order to be considered for an internship with NXP, you must be returning to school (or graduating) at the conclusion of the internship term. If you are graduating prior to August 2026, please apply for positions labeled “Graduate Hire” or “Entry Level”.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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