Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging)

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Robert Bosch Inc. (Philippines) has diversified businesses in Power Tools, Automotive Aftermarket, Automotive Original Equipment, Building Technologies, Thermotechnology, and Drive and Control Technology (Bosch Rexroth). Additionally, the company’s Packaging Technology and Home Appliances businesses are represented through appointed local agents. In 2017, Bosch generated sales of USD 51 million (45 million euros) in the Philippines. Bosch continues to build its nationwide network as a socially responsible provider of innovative and beneficial technologies to the Philippines.

We are seeking a development engineer for MEMS assembly and interconnect technologies who likes to cooperate closely with our partners. You will work with industry-leading OSATs, machine and material suppliers to develop packaging processes that enable the realization of a large variety of MEMS devices.

• Working on-site at one of the largest assembly partners closely cooperating with the local teams of our supplier.
• Part of a team of packaging experts within Bosch and our suppliers to develop and characterize new and innovative optical MEMS device packages.
• Part of an interdisciplinary product development team with customer representatives, purchasing, MEMS design and technology, reliability, testing, simulation, construction, production, and quality team members.
• Responsible for the material and machine selection and associated process development for core assembly steps.
• Selecting and qualifying new suppliers (assembly subcons, equipment and raw material suppliers).
• Co-working with equipment suppliers to enhance existing or to develop new machines.
• Take care of the development, qualification, and transfer to mass production of new assembly processes and materials.
• Owner of specifications and technical documentation concerning the optical MEMS package, assembly process, and raw materials.

• Education: Master or Bachelor degree in material or natural science (physics, chemistry), or mechanical / electrical engineering or material science.
• Experience and Skills: Minimum of 3 years, preferred 7 years of experience in sensor and/or package development.
• Knowledge and skills in EOL assemble handling, BGA, QFN, LGA, MEMS packages, FOL, EOL assembly, FMEA, SPC, and 8D.
• Personality: team player, problem solver, broad technical interests, creativity, initiative, autonomy, flexibility, leadership, agility, with ability to work with minimum supervision.
• Languages: Very good English skills in speaking and writing.
• Intercultural Skills: Willingness to travel.

Your future job offers you.

Flexible work time, medical services, and benefits & services.