PROCESS ENGINEER

Job Duties:

• Own and sustain Die Attach processes, including parameter control, material management, and process stability
• Monitor daily performance, yield, scrap and drive corrective actions when deviations occur
• Lead structured problem-solving for issues such as die tilt, epoxy flow, voids, curing issues, glue discoloration, and material variation
• Support NPI activities: DOE, machine capability studies, qualification runs, documentation, and customer audits
• Optimize processes for yield improvement, cost reduction, cycle time reduction, and equipment efficiency
• Collaborate closely with Production, Equipment Engineering, QA, PE, and suppliers to resolve issues and implement improvements
• Evaluate and qualify materials (epoxies/glue), tools (nozzles, collets), and die bonding equipment
• Maintain and update engineering documents (WI, OCAP, FMEA, Control Plan, parameter specification)
• Ensure safety, quality, and process compliance according to company standards

Job Requirement :

• Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, Materials Engineering, or related field.
• 2+ years of experience in Die / Component Attach & Cure processes or related assembly/front‑end semiconductor processes.
• Strong background in process sustaining, yield improvement, and defect reduction in high‑volume manufacturing FMEA and Control plan.
• Demonstrated capability in process change management, including risk assessment, qualification, and controlled implementation across manufacturing sites.
• Strong collaboration skills working with global teams, suppliers, and cross‑functional partners.
• Excellent communication and presentation skills for technical and management audiences.
• Self‑driven, disciplined, and capable of working independently with strong ownership.
• Proficient in Microsoft Office tools for analysis, reporting, and presentations

More information about NXP in Thailand...

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