Principal Engineer, Thermal Engineering

Job Details: Job Description: As a senior member of Intel’s Thermal Mechanical Engineering team, you will lead the development of advanced thermal and mechanical solutions for Data Center CPUs—spanning silicon, system, and datacenter levels. This role requires deep technical expertise, strong collaboration skills, and the ability to thrive in a fast-paced environment. Key Responsibilities: Define product power and temperature limits based on system cooling capabilities. Provide thermal parameters for manufacturing teams. Conduct thermal analysis, design, prototyping, and testing of air and liquid cooling solutions. Apply expertise in conduction, convection, radiation, heat sinks, heat pipes, and vapor chambers. Perform thermal and pressure drop characterization and validate models. Optimize thermal management systems, including materials, contact pressure, and firmware policies. Simulate thermal behavior from silicon to PCB, considering materials, layout, and transient effects. Lead thermal design reviews and resolve technical issues. Collaborate cross-functionally with design, power, reliability, electrical, and mechanical teams. Drive technical readiness through research, experiments, and prototyping. Additional Responsibilities: Serve as a domain expert influencing technical direction across Intel and the industry. Mentor technical leaders and promote Intel values. Formulate technical strategy aligned with organizational goals and deliver leadership solutions. Drive innovation in modeling, simulation, and automation to accelerate design cycles. Analyze performance, power, and thermal characteristics to guide design trade-offs. Lead teams in detailed design, testing, and prototype fabrication. Qualifications: Qualifications: Minimum Requirements: Bachelor’s degree in Mechanical Engineering or related field with 10+ years of related experience 8+ years of experience in: Heat transfer fundamentals for data center or client systems . Thermal testing techniques using sensors and wind tunnels. Thermal simulation software (Flotherm, Icepak). CFD tools and thermal modeling processes Preferred Qualifications: Advanced degree (MS/PhD) in Mechanical Engineering with focus on Heat Transfer, Fluid Dynamics, and Electronics Cooling. Proficiency in Python, MATLAB, LabVIEW, and statistical analysis. Hands-on experience with thermal metrology, DOE, instrumentation, and uncertainty analysis. Strong project leadership and cross-functional collaboration skills. Expertise in electronics cooling for systems/platforms, racks, and datacenters. Deep knowledge of TIMs, heat sinks, vapor chambers, heat pipes, fans, and liquid cooling systems. CAD proficiency (SolidWorks or Creo) and CFD experience. Experience managing ODMs/vendors and full product lifecycle from concept to production. Familiarity with acoustic testing, DFM, and high-volume manufacturing. Ability to integrate novel thermal technologies aligned with Intel’s roadmap. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business group: At the Data Center Group (DCG), we're committed to delivering exceptional products and delighting our customers. We offer both broad-market Xeon-based solutions and custom x86-based products, ensuring tailored innovation for diverse needs across general-purpose compute, web services, HPC, and AI-accelerated systems. Our charter encompasses defining business strategy and roadmaps, product management, developing ecosystems and business opportunities, delivering strong financial performance, and reinvigorating x86 leadership. Join us as we transform the data center segment through workload driven leadership products and close collaboration with our partners. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter. Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003 Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.