Platform TPM

About Etched

Etched is building AI chips that are hard-coded for individual model architectures. Our first product (Sohu) only supports transformers, but has an order of magnitude more throughput and lower latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents.

Job Summary

Etched is seeking a highly skilled and motivated Technical Program Manager (TPM) to lead program execution across our system and rack-level initiatives for AI datacenter hardware. This role focuses on end-to-end delivery of chassis and rack solutions at scale, working closely with internal engineering teams, external ODMs, and supply chain partners to ensure seamless integration of hardware platforms into production environments.

As a strategic leader, you will manage system-level programs such as chassis, trays, racks, and manifolds, ensuring projects are delivered on time, at quality, and within budget. You will collaborate with platform, ASIC, and software teams while driving alignment with external vendors and rack integrators to deliver optimized datacenter-ready solutions.

Key Responsibilities

• Drive execution of system and rack-level programs, including chassis development (e.g., 6U chassis from ODM), tray solutions, rack customization, and liquid cooling/manifold integration.

• Manage ODMs and suppliers for system and rack hardware, ensuring timely delivery of chassis and trays at scale while meeting engineering and operational requirements.

• Oversee rack solution customization, including mechanical, electrical, and thermal aspects, and coordinate with facility teams to align with datacenter deployment standards.

• Identify critical paths and risks in system integration programs; develop and execute mitigation strategies to keep schedules on track.

• Facilitate collaboration across internal stakeholders (platform solutions, ASIC silicon design, software engineering) to ensure seamless integration into system-level solutions.

• Establish and track KPIs for rack and system-level program execution, ensuring progress transparency and accountability across all teams.

• Regularly communicate program status, risks, and key decisions with executives and engineering leaders.

• Continuously refine program management processes to improve efficiency in system manufacturing, rack delivery, and operational readiness.

• Leverage understanding of hardware platforms, rack-level integration, and datacenter infrastructure to resolve cross-functional issues quickly.

You might be a good fit if you have

• Bachelor's degree in Electrical Engineering or a related technical discipline.

• 5+ years of experience in technical program management, hardware NPI, or manufacturing program leadership for PCBAs or complex electronic assemblies.

• Hands-on experience working with contract manufacturers for board-level builds, including EVT/DVT/PVT and volume production.

• Strong understanding of PCB fabrication, SMT assembly, board-level test, and manufacturing quality systems.

• Demonstrated experience managing technical relationships across multiple vendor levels (component suppliers, PCB fabs, assembly CMs, integrators).

Strong candidates may also have experience with (Nice-to-have qualifications)

• Experience managing supply chain complexity across L6/L10/L11/L12 vendor ecosystems for high-reliability or high-performance computing hardware.

• Familiarity with high-speed digital design, power delivery architectures, or AI/ML accelerator hardware manufacturing.

• Background in high-volume electronics manufacturing or complex system integration programs.

• Experience with vendor qualification, capability assessments, and multi-sourcing strategies.

• Comfort operating in fast-paced, ambiguous environments with high technical and executional complexity.

• Strong communication and organizational skills, with the ability to align internal teams and external manufacturing partners across diverse vendor types and technical domains.

Base Compensation Range

• $175,000 - $250,000

Benefits

• Medical, dental, and vision packages with generous premium coverage

• $500 per month credit for waiving medical benefits

• Housing subsidy of $2k per month for those living within walking distance of the office

• Relocation support for those moving to San Jose (Santana Row)

• Various wellness benefits covering fitness, mental health, and more

• Daily lunch and dinner in our office

How we’re different

Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.

We are a fully in-person team in San Jose and Taipei, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.