PICs@ICFO Strategic Initiative: Process Engineer or Research Scientist in PIC Packaging

As part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project—two flagship programs aimed at advancing Photonic Integrated Circuits (PICs) in Europe.
As part of our expanding efforts, we are reinforcing our leadership in the full PIC value chain—including design, fabrication, advanced packaging, testing, and application development.

We are seeking up to two Process Engineers or Research Scientists with hands-on experience in packaging and assembly of photonic integrated circuits (PICs). The selected candidates will play a key role in the experimental development of advanced PIC technologies within the PICs@ICFO strategic initiative.
The position is hands-on and lab-oriented, suited for candidates with a solid technical background and a passion for practical work with integrated photonic devices.

Key Responsibilities:

Development and optimization of Photonic Packaging technologies (e.g. die bonding, wire bonding, optical coupling, hybrid integration) on semi-automated assembly machines – including process programming and setup.

Support on suppliers and material selection to ensure quality and process compatibility.

Closely work with cross-functional team (including PIC, optical, mechanical and RF designers) to implement manufacturable and scalable packaging processes.

The candidate will be expected to collaborate closely with design, fabrication, and testing teams to ensure performance consistency across the development cycle.

This position will report to the Prof. Dr. Valerio Pruneri, Scientific Coordinator of the PICs@ICFO Strategic Initiative encompassing the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project.

Aquest contracte està cofinançat amb el Fons Europeu de Desenvolupament Regional (FEDER) de la Unió Europea, en el marc del Programa del FEDER de Catalunya 2021- 2027.

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https://jobs.icfo.eu/?detail=1077

Applicants must hold, at the time of appointment, an internationally recognized engineering or science degree (BSc, MSc, or PhD) in Electrical Engineer, Mechanical Engineering, Photonics or related fields.

Applicants must meet the following minimum requirements:

3 years of professional experience in an industrial or R&D environment related on microelectronics or photonics.

Candidates will be evaluated based on the following criteria:

Hands-on experience with one or more packaging technologies such as wire bonding, flip chip bonding, fiber pigtailing, wafer bonding, polishing, dicing, etc.

Familiarity with front-end and back-end integrated photonics fabrication technologies.

The ideal candidate is pragmatic and detail-oriented, collaborative and motivated to work in a multidisciplinary environment bridging research and industrial applications.

What We Offer

Indefinite contract for scientific and technical activities pursuant to Spanish Law 14/2011, linked to the duration or availability of funds within Catalan PhotonChip project.

Access to state-of-the-art facilities for photonic packaging and testing.

Opportunity to develop hands-on expertise in advanced photonic technologies at the interface between academia and industry.

A family allowance may be granted to candidates with dependents, upon request and in accordance with ICFO’s policies.

ICFO is an equal opportunity employer. We hire based solely on merit and potential, regardless of gender, nationality, or disability. ICFO fully endorses the European Charter for Researchers and Code of Conduct for the Recruitment of Researchers, ensuring a transparent and supportive recruitment process.

Suitable candidates are requested to submit:

A presentation letter outlining your interest in the position.

A curriculum vitae, including full contact information.

The contact e-mail addresses of two referees who can provide professional references.

Applications will be reviewed as they are received.

For formal enquiries regarding the application process, please contact: [email protected]

For project and technology enquiries, please contact: [email protected]

For more information about ICFO, visit: https://www.icfo.eu/.

28th of February, 2026