PICs@ICFO Strategic Initiative: Engineer or Research Scientist in PIC Packaging and Testing

As part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project—two flagship programs aimed at advancing Photonic Integrated Circuits (PICs) in Europe.
As part of our expanding efforts, we are reinforcing our leadership in the full PIC value chain—including design, fabrication, advanced packaging, testing, and application development.

We are seeking an engineer or research scientist with hands-on experience in either packaging or testing and characterization of photonic integrated circuits (PICs). The selected candidate will play a key role in the experimental development of advanced PIC technologies within the PIXEurope pilot line and the PhotonChip project.

The position is hands-on and lab-oriented, suited for candidates with a solid technical background and a passion for practical work with integrated photonic devices — whether in testing/characterization or packaging and assembly.

Key Responsibilities:

Depending on the selected profile, the candidate will focus on one of the following main areas:

For Testing and Characterization:

Perform optical and electrical characterization of photonic integrated circuits, including bare dies, wafer level tests and packaged devices.

Conduct automated and manual testing of PIC components, subsystems, and assemblies.

Set up and operate optical benches and electrical test stations (lasers, optical spectrum analyzers, RF instruments, probe stations).

Develop and execute measurement procedures, data acquisition scripts, and result analysis.

For Packaging and Assembly:

Development and optimization of Photonic Packaging technologies (e.g. die bonding, wire bonding, optical coupling, hybrid integration) on semi-automated assembly machines – including process programming and setup.

Support on suppliers and material selection to ensure quality and process compatibility.

Closely work with cross-functional team (including PIC, optical, mechanical and RF designers) to implement manufacturable and scalable packaging processes.

All candidates will be expected to collaborate closely with design, fabrication, and testing teams to ensure performance consistency across the development cycle.

This position will report to the Prof. Dr. Valerio Pruneri, Scientific Coordinator of the PICs@ICFO Strategic Initiative encompassing the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project.

Aquest contracte està cofinançat amb el Fons Europeu de Desenvolupament Regional (FEDER) de la Unió Europea, en el marc del Programa del FEDER de Catalunya 2021- 2027”.

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Applicants must hold, at the time of appointment, an internationally recognized engineering or science degree (BSc, MSc, or PhD) in Photonics, Electrical Engineering, Physics, or related fields.

We are looking for candidates with demonstrated experience in one or more of the following areas:

Optical and electrical testing of photonic devices or systems (e.g., insertion loss, transmission, or RF characterization).

Operation of test and measurement equipment (e.g., tunable lasers, VNAs, power meters, photodetectors).

Data acquisition, automation, and analysis using Python, MATLAB, or LabVIEW.

Development of Photonic Packaging and Assembly processes, like flip chip bonding, wire bonding, pigtailing, wafer dicing, etc.

Familiarity with front-end and back-end Si-photonics fabrication technologies.

Experience in an industrial or R&D lab environment focused on photonics or micro/nano-fabrication will be considered an advantage.

The ideal candidate is detail-oriented, collaborative, and motivated to work in a multidisciplinary environment bridging research and industrial applications.

What We Offer

Indefinite contract for scientific and technical activities pursuant to Spanish Law 14/2011, linked to the duration or availability of funds within Catalan PhotonChip project.

Access to state-of-the-art facilities for photonic packaging and testing.

Opportunity to develop hands-on expertise in advanced photonic technologies at the interface between academia and industry.

A family allowance may be granted to candidates with dependents, upon request and in accordance with ICFO’s policies.

ICFO is an equal opportunity employer. We hire based solely on merit and potential, regardless of gender, nationality, or disability. ICFO fully endorses the European Charter for Researchers and Code of Conduct for the Recruitment of Researchers, ensuring a transparent and supportive recruitment process.

Suitable candidates are requested to submit:

A presentation letter outlining your interest in the position.

A curriculum vitae, including full contact information.

The contact e-mail addresses of two referees who can provide professional references.

Applications will be reviewed as they are received.

For formal enquiries regarding the application process, please contact: [email protected]

For project and technology enquiries, please contact: [email protected]

For more information about ICFO, visit: https://www.icfo.eu/.

1st of December, 2025