Physical Failure Analysis Engineer

Physical failure analysis (PFA) involves the localisation, imaging, and characterisation of manufacturing defects in our products. Analysts will be expected to: Utilise a wide variety of fault localisation and imaging tools/techniques, including but not limited to Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Energy Dispersive X-ray Spectroscopy (EDX), Focused Ion Beam (FIB), SEM-based Nanoprober Understand electrical failure analysis (EFA) data and determine the best PFA plan forward based on that data Document findings in professional reports to be shared with various stakeholders Collaborate with cross-departmental teams such as Customer Quality Engineering, Manufacturing, and other FA labs Have an understanding of manufacturing processes and the root cause of defects Job Qualification Bachelor's or Master's degree ​in Electrical/Electronics/Materials Engineering Fresh Graduates or with not more than 2 years’ work experience Basic technical knowledge of semiconductor physics and MOSFET operations Knowledge of common computer software packages, such as Word, Excel, PowerPoint, etc Able to work with chemicals, X-Ray, Electron and Ion Beam tools Comfortable with handling small and delicate samples with tweezers The following are not required but would be a benefit/plus: Experience in a laboratory/wafer fab/similar manufacturing environment Experience with beam tools (SEM/TEM/FIB) Familiar with the FA process flow and analysis techniques Knowledge of semiconductor manufacturing processes (wafer fabrication as well as assembly) Strong problem solving skills, (e.g., 8D or similar practice) attention to detail, good communication skills (both written and verbal) and the ability to produce quality results in a timely fashion are also essential attributes. More information about NXP in Malaysia... #LI-633a