Physical Design Lead/Manager
Omnidesigntech
Posted: January 6, 2025
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Quick Summary
We are looking for a Lead/Manager of Physical Design to own and drive the physical implementation of next-generation Mixed-Signal SOC with HS ADC/DAC, HS interfaces like PCIe, LPDDR, MIPI, USB2/3, Gig Ethernet etc.
Required Skills
Job Description
Omni Design is working on exciting solutions and chips for next generation automotive and space applications and looking for talented and capable engineers.
Omni Design is developing exciting high-speed Mixed-Signal SOC. We are looking for a Lead/Manager of Physical Design to make these high performance Mixed-Signal SOCs a reality
Role and Responsibility:
• Own and drive the physical implementation of next-generation Mixed-Signal SOC with HS ADC/DAC, HS interfaces like PCIe, LPDDR, MIPI, USB2/3, Gig Ethernet etc.
• Understand the requirements and define physical implementation methodologies.
• Collaborate with architecture, design, front end and CAD teams to deliver high-quality physical designs.
• Implement and verify designs at all levels of hierarchy in the SOC.
• Interact with foundry over matters of technology, schedule, and signoff
Qualifications and Experience:
• BSEE Required, MSEE Preferred
• 8+ years of experience of physical design in SOCs.
• 3+ years of experience in managing projects and leading teams.
• Hands-on expertise in all of the following areas: Floorplanning, Power planning, Implementation of UPF Methodology, Logic and clock tree synthesis, Placement , Timing Closure, Routing, Extraction, Physical Verification (DRC & LVS), Crosstalk Analysis, EM/IR
• Full chip/ top-level expertise in multiple chip tape-outs.
• Good understanding and experience in SCAN, BIST, and ATPG.
• Strong background in TCL/Perl/Python programming is a must.
• Expertise in double patterning process nodes is desirable. Experience with sub 40 nM nodes required
• Expertise in Cadence or Synopsys RTL-to-GDSII flow is preferred.
Expectations:
• Do the FC Floor Plan and Layout
• Set up the EDA tools and develop the scripts
• Develop the UPF methodology
• Implement the Power, Clock Grid
• Generate the SDF files
• Do the DRC, ERC, LVS, SI and Cross talk checks, Do the DFM checks
• Tapeout the chip
• Manage and mentor the PD and custom layout team
• Make changes, as needed to the custom layout of the IP
• Release the GDS2 to the Fabs