Packaging Module Development Engineer

Job Details: Job Description: - Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization - CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process - Candidate will focus on Process and Technology Development for New Product (NPI), Shuttle Program, Test Vehicle and Foundry Product. - Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization - Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories. - Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. - Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. - Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations. - Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance. Qualifications: - MSc/MEng/BEng degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics), - Research and Development background from MSc is preferred . - Collage Graduate is preferred or less than 1 years experience - Fundamental understanding of semiconductor assembly equipment and process. - Excellent influencing, written and verbal communication skills. - Strong data analysis capabilities and problem-solving skills. - Proactive and positive approach towards challenges. - Able to work under tight timelines and schedules, and perform under pressure. Job Type: College Grad Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Kulim Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.