Packaging Module Development Engineer

Job Details:

Job Description:

• Board Assembly Technology Development (BATD), part of Intel's Assembly Technology Development (ATD) packaging team, cater to Intel's customer product assembly needs and certify Surface Mount Technology (SMT) manufacturing for new Central Processing Unit (CPU), Chipset, System on Chip (SoC) BGA packages, and Socket Technology.

• The Board Assembly Technology Development Lab in Kulim, Malaysia, offers SMT manufacturing, provides expertise in technology development, enabling next-generation product roadmaps through innovative solutions in circuit board technology, assembly processes, and materials.

In this role, you will be a Packaging Module Development Engineer focuses on process technology development for SMT processes.

• Your responsibilities will include developing SMT process solutions and recommendations for Intel's integrated circuit (IC) packages and sockets to support new IC package development.

What you will do:

• As a Packaging Module Development Engineer, you will be tasked with developing and validating board assembly process solutions to meet Intel's next-generation product requirements.

• Your responsibilities will include creating SMT process solutions for Intel IC packages and sockets, identifying and addressing root causes of defects in SMT process development.

• You will also be responsible for SMT Process Development.

• Design and optimize SMT processes, including stencil design, solder paste selection, reflow profiling, and inspection criteria to ensure high yield and reliability.

• Testing of prototype boards, utilizing advanced equipment such as X-ray inspection and automated optical inspection (AOI)

• Data Analysis: Utilize statistical tools and software to analyse process data, identify trends, and drive continuous improvement initiatives.

• Documentation and Training: Develop detailed process documentation and provide training to manufacturing teams to ensure consistent implementation of new technologies.

Qualifications:

Minimum Qualifications:

• Possess a Bachelor's degree or Master's degree in Mechanical Engineering or Materials Science or Chemical Engineering, Mechatronic, Applied Physics or a related engineering field.

• Experience in or conduct project/assignment in data analytic, statistical analysis.

• Experience in any SMT or printed Circuit Board Assembly (PCBA) processes is an added advantage.

The candidate should exhibit the following behavioral traits and/or skills:

• Self-starter, detail orientated, discipline and good in communication.

Job Type:

College Grad

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.