München: Work Package 1: Embedded HIL Test, Work Package 2: Embedded Unit Testing/GTest
Confidential
Posted: February 11, 2026
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Job Description
Project Description
Location: München
Work Mode: Vor Ort (On?site)
Project Duration: 6–8 Months
Overview
This project consists of two technical work packages aimed at enhancing the quality, reliability, and testability of embedded firmware. The first work package focuses on building a Hardware?in?...
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