Lead Project Engineer- Design Electronics
NorthStarStaffingSolutionsInc
Posted: November 21, 2014
Interested in this position?
Create a free account to apply with AI-powered matching
Quick Summary
Responsible for leading new camera design project which includes indirect leadership over project team, meeting timelines, providing updates to management on project progress, and working with internal and external customers.
Required Skills
Job Description
Req # : 8063 | Type: Full Time | Posted: 10/27/2014 | Edited: 10/29/2014 | Fee: 20.00% Percentage Computed On Base Salary
minimum: $75,000
maximum: 104,000
target: N/A
bonus:5%
travel: none required
sponsor/transfer H-13 and/or H-2B: No
sponsor/transfer work permits: No
paid relocation: No
industry: Automotive parts
Responsibilities:•Responsible for leading new camera design project which includes indirect leadership over project team, meeting timelines, providing updates to management on project progress, and working with internal and external customers.
•Provides Electronic design
•Ensures that Electronic Design meets electronic requirements.
•Ensures that design guidelines are fulfilled
•Ensures that design will be reviewed
•Performs Impact Analysis on Engineering Change
•Update design according to Engineering Change
•Releases Design Change
•Analyses Validation Test Results and Characterization test results
•Interface with cross functional groups (Hardware, Software, Mechanical, Optics, Manufacturing)
Requirements:
•5+ years of combined engineering and management experience.
•Demonstrable experience in working in, and leading team efforts.
•Strong written, verbal, and presentation skills.
•Ability to read, analyze, and interpret complex documents such as customer requirements and international specifications.
•Knowledge of Design tools and methods for High speed HDI designs
•Knowledge of review methods
•Design Knowledge for High speed digital & analog (Power supply, DSP, DDR ) electronic components and circuitry
•Capability to ensure design compliance to customer specifications
•Capability to select appropriate materials and components
•Capability to perform and interpret stack-up analysis and worst-case analysis
•Capability to use lab tools, equipment, and techniques to verify proper functioning of circuit design
•Knowledge of ASIC Analogue/Digital design and HDI PCB layout
•Knowledge of simulation (hyperlynx) and measurement techniques for DDR
All your information will be kept confidential according to EEO guidelines.