Lead Hardware Solutions Architect

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is seeking a Lead Hardware Solutions Architect to own and coordinate the RTL modifications required to meet diverse customer needs. You will bridge the gap between customer silicon engineers and internal DV engineers, ensuring that every RTL change is technically sound and fits into the broader system architecture. You are the primary owner of custom NEO configurations, balancing specific customer requests with long-term product scalability.

This role is hybrid, based out of Toronto, Austin, TX or Belgrade, Serbia.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• Experienced RTL and silicon architect who understands full-chip and subsystem design tradeoffs.

• Comfortable evaluating RTL changes for performance, power, area, and system impact.

• Strong cross-functional partner who keeps customers, design, and DV aligned.

• Mentor who sets clear technical direction and supports junior engineers’ growth.

What We Need

• Lead RTL customization for NEO, owning customer-specific configurations and changes.

• Translate customer silicon requirements into clear RTL and verification work items.

• Assess hardware changes for impact on system behavior, firmware, and software stacks.

• Drive convergence on secure, reliable, and scalable custom silicon solutions.

What You Will Learn

• How to coordinate silicon, system, and software teams around shared customer outcomes.

• How advanced AI chip projects run from architecture through implementation and bring-up.

• How customers deploy NEO-based solutions across varied platforms and constraints.

• How to shape Tenstorrent’s custom silicon roadmap through real customer workloads.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.