Lead Electro Mechanical Packaging Design & Analysis Engineer

Lead Electro Mechanical Packaging Design & Analysis Engineer

Company:

Boeing India Private Limited

Overview

As a leading global aerospace company, Boeing develops, manufactures and services commercial airplanes, defense products and space systems for customers in more than 150 countries. As a top U.S. exporter, the company leverages the talents of a global supplier base to advance economic opportunity, sustainability and community impact. Boeing’s team is committed to innovating for the future, leading with sustainability, and cultivating a culture based on the company’s core values of safety, quality and integrity.

Technology for today and tomorrow

The Boeing India Engineering & Technology Center (BIETC) is a 5500+ engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace.

People-driven culture

At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring together different perspectives and thoughts – enabling every voice to be heard and every perspective to be respected.  No matter where or how our teammates work, we are committed to positively shaping people’s careers and being thoughtful about employee wellbeing.

With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace.

The Boeing India Engineering and Technology Center (BIETC) is looking for a Electronics Packaging Design & Analysis Engineer for a key role in development of a growing business unit.  The position will be a hands-on technical role with responsibility ranging from printed circuit board design requirements, chassis design and development, thermal, structural, fatigue and materials selection, detailed design, documentation and analysis. The successful candidate should have a track record of demonstrated successes from previous work assignments.

Position Responsibilities:

• Lead the mechanical design and development projects on complex electro-mechanical LRU and components.
• Develop mechanical design concepts for chassis, enclosure, PCB mounts to address system requirements, weight, cost and thermal constraints.
• Develop and execute structured technical plans to address product issues, define priorities, and allocate engineering resources effectively. Ensure planning is aligned with production timelines, customer commitments, and program milestones
• Lead product support engineering activities from mechanical for issue resolution during production. Will need to solve mechanical problem and possess the ability to proactively engage stakeholders towards resolution.
• Requirements management: Analyzing Customer & System Requirements to develop mechanical design concepts for various avionics Line Replaceable Units.
• Design Calculations: Perform design calculations, stack up analysis, machined chassis development and support in developing mechanical design concepts.
• Validation and interpretation of analysis results of enclosure/ chassis, replicating power dissipation values.
• Exposure and thorough understanding on Air Transport Avionics Equipment Interfaces, ARINC & VITA Specification.
• Identifying and tracking technical performance metrics to measure progress and ensure compliance with program requirements.
• Collaborating & communicating with cross functional teams and all stakeholders, especially electronics circuit designers and manufacturing engineers to ensure that the hardware meets imposed customer and derived requirements in compliance to avionics standard and regulations.
• Providing technical guidance, mentor and train team during project execution while managing one or more projects.
• Executing end-to-end project management, including configuration management and change control.
• Represent mechanical engineering in Integrated Product Teams (IPTs), coordinating with design, manufacturing, quality, and supplier management to address and resolve complex challenges.
• Must be able to work well with domestic and global teams from a modern innovative and collaborative environment.
• Prepare technical documentation such as RAC, Test procedure, Test Plan, Qual Plan, Service bulletin
• Liaison between unit managers and mechanical engineers towards successful implementation of product changes
• Conduct DO-160 Qualification testing for Structural, Thermal, and other Environmental conditions.

Basic Qualifications (Required Skills/Experience):

• A Bachelor’s Degree or equivalent in engineering is required.
• Mechanical or any Engineering degree with 12+ years of related work experience, or a Master's degree with 11+ years' of related work experience.
• Must have Strong Mechanical Product design expertise with a focus on hands on experience in new product design and development of Electronic Line Replaceable Unit
• Preferred work experience in production support to resolve technical/Engineering issues during production
• Hands-on experience with root cause analysis techniques
• Experience working with multi-disciplinary teams including electrical, systems, and manufacturing engineering
• Excellent problem-solving skills and ability to make decisions under pressure
• Strong communication and collaboration abilities across internal and external stakeholders
• Understanding of GD&T, thermal management, fastener selection, and enclosure design.
• Ability to interpret technical drawings, BOMs, and qualification reports.
• Experience in Mechanical Chassis design (End-to-End) for Machined/Sheet metal LRU and test equipment.
• Experience in Aerospace – conducting DO-160 Qualification testing including preparation of Qualification Test Procedure and Reports. 
• Experienced in Manufacturing of Machined and sheet metal components. Must have DFM/DFA and design for reliability exposure.
• Experience in detailed development and COTS selection of power and analog/control electronic printed circuit boards, connectors, modules, chassis, heat sink and mechanical fasteners.
• Preferably experience in Heat Sink Design, Fan Selection, TIM selection, design for heat pipes, component, and System level cooling.

Typical Education & Experience:

Mechanical Engineering degree and 12+ years of related work experience, or a Master's degree and 11+ years' of related work experience.

Relocation:

This position offers relocation based on candidate eligibility.

Language Requirements:

Not Applicable

Education:

Bachelor's Degree or Equivalent

Relocation:

This position offers relocation based on candidate eligibility.

Security Clearance:

This position does not require a Security Clearance.

Visa Sponsorship:

Employer will not sponsor applicants for employment visa status.

Contingent Upon Award Program

This position is not contingent upon program award

Shift:

Not a Shift Worker (India)