Internship - IC Packaging Design

The future starts here! Ready to join NXP? Become part of the Packaging Innovation Design Group developing novel design tools and methods while serving the entire global NXP organization. There is a lot of room for new ideas and innovation with continuous focus on development in a supportive environment. Your Team The Packaging Innovation Design Group provides package design for various business groups including automotive, industrial, edge processing and analog markets. These products enable edge AI and machine learning among other technologies using package architectures that meet performance, quality and cost targets. We are currently looking for a student for a 6-month internship to bring efficiency improvements to the design tools and flows by designing, optimizing, and automating the software and systems used by the design teams. The role will apply scientific and engineering principles to develop and/or deploy new software code to automate design flow and software. Student must leverage creative, state-of-the-art engineering principles and theories to effectively translate to best practices in the design department. This candidate will participate in developing and maintaining the overall EDA tool strategy and design flow methodologies for package design within NXP. Your Responsibilities Knowledge of semiconductor package design with a specific focus on leading edge substrate-based packages such as Wire-Bond and Flip Chip PBGA. Knowledge of Cadence APD SIP, Allegro, Orbit IO, and/or AutoCAD. Knowledge of Python, SKILL, RAVEL, VBA programming languages. Experience with die to package co-design flows and knowledge of tools such as Virtuoso, Innovus and ICC2. Familiarity with various package substrate technologies and materials including HDI/build-up, coreless and conventional mechanically drilled. Ability to independently deliver results within the diverse technical global team within NXP as well as substrate, assembly and EDA suppliers. The candidate must be able to define and implement changes and improvements in design flow and tools where required. Working knowledge of die, package and/or PCB-level electrical simulation and parasitic extraction tools such as HFSS, Apache, Clarity, Sigrity, and Momentum is a plus. What’s in it for you A great opportunity to develop your skills (technical, soft skills, communication, etc.) Gaining experience in a multinational and diverse environment Possibility to become part of NXP’s Young Professional Talent Pool Working on real assignments which contribute to NXP’s objectives Your Profile Student enrolled in Electrical Engineering, Computer Science or similar discipline Bachelors or Masters program. Excellent problem-solving and interpersonal communication skills are required. MS Office experience required including advanced knowledge of MS Excel. Good level of English is required (attendance to meetings / presentations with international team, reading and writing of documentation) Duration This is a full-time internship (40 hours per week) with a duration of 6 months or longer. The assignment could also be suitable as a thesis/graduation project. Please note that in order to be considered for an internship/working student assignment, you need to be registered as a student during the entire period. Creating Secure Connections and Infrastructure for a Smarter World NXP Semiconductors N.V. (NASDAQ: NXPI) makes products and environments safer, more sustainable, and more secure with innovative connectivity and edge processing solutions for a smarter world. We are in the business of better. Not just better technologies, but better innovations to improve society. As the world leader in secure connectivity and processing solutions for embedded applications, NXP is solving the world’s most complex technology challenges to accelerate business innovation, enhance how we work, and advance how we live. If you are as excited about this opportunity as we are, we kindly invite you to apply. After a screening based on your profile you can be expected to have a video interview with our Talent Acquisition Consultant followed by business. What Can You Expect? Development opportunities: We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we provide you with a mix of learning through on-the-job experiences, learning from industries bests, and learning through education to help you develop your core and professional skills. Our offices: The Netherlands is home to our global headquarters (Eindhoven) along with two additional sites (Nijmegen, Delft) and includes a diverse team of over 2000 employees with 51 different nationalities focused on R&D, manufacturing, product development, business operations, legal and sales. Hiring process: Applying only takes a minute! Fill in the online application and share your CV with us. After a positive screening based on your CV you will have an initial video conversation with our Talent Acquisition Consultant followed by several business interviews. Here are some useful tips to help you prepare. And more: Life at NXP is more than work alone. Join one of the many social activities that are organized by and for employees in the Netherlands, such as our Christmas parties and International Walking Day. We have a YOUNG community that organizes a mix of social and professional events for our young professionals and an active Women in NXP. We also take time to give back to our communities by engaging young girls to learn about Technology during Girls Day or participating in several volunteering activities. What’s Next? If you’re excited about this opportunity, we kindly invite you to apply! If you have any questions, we are happy to answer them. Please contact, Chanchal Sharma, Talent Acquisition Specialist on chanchal.sharma_1@nxp.com More information about NXP in the Netherlands... #LI-0d06