Hardware Design

Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch GmbH, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 27,000+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is the Technology Powerhouse of Bosch in India with a global footprint and presence in the US, Europe and the Asia Pacific region.

Job Title: Automotive High-Speed Hardware Design Engineer

• Experience Level:5 – 9 Years

• Location:[ Bangalore--Electronics City]

 

• Job Summary:

We are seeking an experienced Automotive High-Speed Hardware Design Engineer to lead the design and development of advanced electronic control and compute platforms for ADAS, Cockpit, IVI, and Connectivity systems. The role involves working on SoC-based, ASIL-D compliant hardware, with focus on high-speed interfaces, thermal design, signal and power integrity (SI/PI), and multi-sensor integration (camera, radar, LiDAR, fusion).The candidate will collaborate closely with system architects, PCB designers, mechanical, and software teams to deliver production-grade hardware solutions for next-generation automotive platforms.

 

• Key Responsibilities:

• Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production.

• Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes.

• Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency.

• Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails.

• Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions.

• Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews.

• Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization.

• Collaborate with PCB layout engineers for constraint-driven designs (impedance, stack-up, crosstalk, EMI/EMC).

• Drive hardware validation and bring-up, including board-level testing, debugging, and root-cause analysis.

• Work with cross-functional teams (System, Software, Validation, Manufacturing, EMC) through design verification and PPAP stages.

• Support DFMEA, DFx (DFM, DFT, DFA) activities to ensure manufacturability and reliability.

• Create design documentation, validation reports, and participate in technical reviews and customer discussions.

 

Required Skills and Experience:

• Bachelor’s or Master’s Degree in Electronics, Electrical, or related engineering field.

• 5–9 years of hands-on experience in automotive hardware design.

• Proven experience with SoC-based board design (e.g., NVIDIA, Qualcomm, Renesas, TI, NXP, Infineon AURIX).

• Strong understanding of ADAS, Cockpit, and IVI architecture including sensor and compute domains.

• Expertise in high-speed design (DDR4/5, PCIe, MIPI, Ethernet, USB 3.x, LVDS, SerDes).

• Experience with SI/PI analysis tools (e.g., HyperLynx, Sigrity, Ansys, Cadence).

• Knowledge of Automotive Safety (ISO 26262 – ASIL B to D compliance).

• Familiarity with EMI/EMC standards (CISPR 25, ISO 11452) and compliance testing.

• Understanding of thermal design, power sequencing, and power distribution.

• Experience in camera/radar interface and sensor fusion hardware design.

• Proficiency in schematic tools (Altium, Cadence Allegro, Mentor DxDesigner, Zuken CR-8000).

• Hands-on experience with hardware bring-up, debugging, and lab instruments (oscilloscope, logic analyzer, power analyzer, etc.).

• Excellent analytical, communication, and documentation skills.

• Experience with ASIL-D compliant ECU development.

• Exposure to Ethernet TSN, CAN-FD, LIN, FlexRay and in-vehicle communication networks.

• Knowledge of thermal simulation and mechanical integration.

• Familiarity with AI/ML accelerator SoCs used in perception and fusion ECUs.

• Experience working with global OEMs and Tier-1s on production projects.

• Key Tools & Technologies:

• Schematic/PCB: Zuken , Altium Designer, Cadence Allegro, Mentor Graphi

BE

5~10