Failure Analysis Technician
NXP Semiconductors
Posted: January 26, 2026
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Quick Summary
Perform failure analysis procedures, utilizing advanced microscopy techniques to characterize defects in materials, and document results in detailed reports.
Required Skills
Job Description
Job Responsibilities:
• Perform physical failure analysis procedures including decapsulation, cross-sectioning, delayering, and focused ion beam (FIB) operations to expose defects.
• Utilize advanced microscopy techniques such as Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDX), and Optical Microscopy for detailed defect characterization and material analysis.
• Document analysis results thoroughly, including detailed images, observations, and conclusions in failure analysis reports.
• Participate in the development and improvement of failure analysis methodologies and processes.
• Adhere to all safety protocols and quality standards within the laboratory environment.
• Assist in troubleshooting and resolving issues related to test equipment and laboratory tools.
Job Descriptions:
• Technical or engineering background.
• College degree or above.
• The ideal applicant should have strong hands-on skills.
• Practical and reliable personality, and the ability to work diligently in a technical environment.
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