Failure Analysis (FA) Engineer

A Failure Analysis (FA) Engineer must be able to interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem. The devices analyzed include new designs/products, low yield on existing products, qualification failures, and returns from customers. The successful candidate will reproduce electrical failures in a lab environment and locate/characterize the defect or anomaly using a variety of electrical, optical, and physical techniques. Collaboration is expected with experts within the FA lab and other organizations, e.g., Design, Test, and Manufacturing. FA results will be documented in formal failure analysis reports. Analysis techniques will involve a range of approaches including: rigorous analysis of the device on evaluation boards (EVBs), detailed in-circuit probing to examine signal behavior & de-processing of the packaged device in order to identify the cause of failure. In addition many advanced tools such as Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), EMMI and Laser Induced Electrical Stimulation tools (e.g. OBIRCH) are used in the investigation, isolation and identification of problems. The following is the BASIC job knowledge/requirements Degree/Masters in Microelectronics, Material Science, Physics or equivalent. Good technical knowledge of digital and analog circuit fundamentals as well as an understanding of the underlying semiconductor device physics and behavior. Understanding of semiconductor packaging processing and able to conduct microscopic examination of failed component to analyze material composition and failure mechanism. Teamwork, problem solving, project management skills. Able to work in dynamic environment supporting various types o analysis for assembly, test and wafer fab operations. Knowledge of common computer software packages, such as Word, Excel, PowerPoint, etc. Ability to work with chemicals, X-Ray, Electron and Ion Beam Tools. The following job experience would be a benefit/plus (but not requirement) Laboratory or wafer fab or similar manufacturing environment is a plus. Microprobe measurement and analysis/test measurement knowledge. Fault Isolation techniques, including LIT, EMMI, OBIRCH, etc. Familiar with the FA process flow and analysis techniques: SEM, EDX, X-ray, X-section (mechanical, ion polisher, FIB) etc. More information about NXP in Malaysia... #LI-633a