Equipment Engineer

NXP Semiconductors

Kuala Lumpur permanent

Posted: April 15, 2026

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Quick Summary

Design and implement packaging solutions to improve efficiency and quality, working closely with cross-functional teams to drive process improvements.

Required Skills

Technical Packaging Collaboration SOP Development Control Plan Enovia 2016X Developer GMM Supplier Collaboration Programming Knowledge Customer Service Packing Quality Packing Method Update APL System Update

Job Description

1.ATKL Packing Material Coordinator, accountable to drive total ATKL packing cost implementation, packing material standardization and packing quality across

2.Work collaboratively with equipment, manufacturing & supplier to improve packing quality related

3.LeadTBE NPI for packing related and ensure timely execution.

4.Lead or need to update SOP, SWE,OCAP, FMEA, Control plan related to packing process

5.Packing qualification (tray, carrier tape, cover tape, desiccant, hic, box, bubble wrap)

6.Update packing method changed in APL system

7.Packing material submission updating ( Enovia, Beeline, GMDM & MMPR)

8.APL full development and implementation

9.SOP, SWE,OCAP, FMEA, Control plan related to packing process

10.New item submit in MMPR GMDM for General Store ordering

11.Work with supplier on daily packing related issue.(ITW- Richard, CPAK- Sam DY on quality)

additional requirement

1.Educational background : Engineering Degree (Electronics or Mechanical or Mechatronics or Chemical)
2.Preferred working experience in semiconductor manufacturing and vision inspection.
3.Speedy, Multi-tasking, results-orientated and able to work in fast phase manufacturing environment.
4.Open-minded, willing to accept new challenges and overcome it with positive attitude.
5.Motivated team player with high level of ownership.
6.Able to communicate with all levels of people.
7.Knowledge/experience in programming language a plus.

More information about NXP in Malaysia...

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