EQUIPMENT ENGINEER
NXP Semiconductors
Posted: May 14, 2026
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Quick Summary
The job involves designing wire bond related parts and tools, rationalizing machine preventive maintenance frequency, and overseeing wire bond machine overhaul.
Required Skills
Job Description
Equipment engineer with ME/EE background to fulfill tasks below.
1. Design wire bond related parts / tool
2. Rationalize machine preventive maintain frequency
3. Cooperate with process engineer to evaluate new wire bond machine
4. Training line repair technician
5. Spare parts lifetime evaluation and safety stock management
6. Standardize machine repair procedure
7. Capability to overhaul wire bond machine
8. Cooperate with IT for production system build up and sustain
More information about NXP in Greater China...
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