Die Attach TD Module Engineer

Job Details: Job Description: The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) as part of TD in Asia initiative. The candidate will define and establish process flow, procedures, and equipment configuration for NPI products. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, reliability, cost, yield, process stability/proficiency, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other virtual factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. A successful candidate should also exhibit the following behavioral traits: Problem-solving, analytical, troubleshooting willingness and communication skills. Qualifications: Minimum Qualifications: Bachelor, Master, or PhD degree in a relevant science, engineering, and technology fields (Physics, Mechanical, Chemical, Electrical, Electronic and Materials Engineering related field), with at least 3 years of relevant working experience or Master/PhD research project on relevant subject. Preferred qualifications: Experience in Thermal Compression Bonding module Involvement in process development in assembly and packaging Led product direct startup/NPI Knowledge in statistical design of experiments to characterize process and problem-solving techniques Proficient in data analytics Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to our staffing team at malaysia.staffing@intel.com. Job Type: Experienced Hire Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Kulim Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.