Bonding/RDL routing/Package Interface

AarnaHRSolutionsPvtLtd

Bengaluru, KA, India permanent

Posted: September 3, 2016

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Quick Summary

Aarna HR Solutions is hiring for Bonding/RDL routing/Package Interface position in Bangalore.

Required Skills

IT Technical Routing Package Interface Power Strap Decap Analysis Switch Configurations

Job Description

Greeting!!

Aarna HR Solutions is a Human Resource Recruitment Company providing services to Various IT, ITES and Non- IT companies across India. Aarna HR Solutions strive towards hiring the best and the brightest talent in the industry. We hire individuals with a strong sense of pride in their performance, team spirit, and a desire to excel.

We have immediate openings for “Bonding/RDL routing/Package Interface" for our Semiconductor client located in Bangalore.

About Position

Position: Bonding/RDL routing/Package Interface

Experience: 3+ Years

Location: Bangalore

Qualification: BE/ B Tech/ M tech

Job Description

• Bonding/RDL routing/Package Interface
• Power Strap Definition
• Decap Analysis
• Switch Cell Distribution strategy

• IR/IVD/EM analysis & fix strategies

If interested please send your UPDATED Profile with below mentioned details.

Current CTC:

Expected CTC:

Notice Period:

Reason for Job Change:

With Regards,

Harshitha- HR Recruiter

Aarna HR Solutions Pvt Ltd

Mob No: 9036516137;

All your information will be kept confidential according to EEO guidelines.

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