Advanced Packaging Market Intelligence

Job Details: Job Description: FS will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with Arm and RISC-V ecosystem IPs. FS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. This business unit is completely dedicated to the success of its customers with full P and L (Profit and Loss) responsibilities. This role will ensure that our foundry customers' products are positioned for success by analyzing advanced packaging trends across the semiconductor market and making sure that Foundry Services is prepared to offer the required technologies in the timeframe in which they are needed. In this role, your responsibilities will include (but are not limited to): Advanced Packaging Market Analysis: Researching prospective customers that leverage advanced packaging to estimate volume by product, expected architecture for each product, and expected ASP for back-end steps for each. Drive alignment with silicon team in Intel Foundry to ensure that front-end and back-end models are aligned on overall market direction. Market Model Publication: Utilize the above data to update and publish the Advanced Packaging Market Model that captures estimated TAM, SAM, and SOM across all advanced packaging architectures by architecture and customer. This model is updated each quarter and the output along with key drivers of changes are to be reported out to the group VP each quarter and ELT 2x per year. Includes providing updates on key customers and notable changes in customer volumes or architectural plans. Supply Analysis: Conduct research to understand expected supply across key advanced packaging metrics to estimate areas of constraint or excess in the LRP horizon, noting implications and associated Intel Foundry strategies. Feedback and Competitive Analysis: Leverage the above analysis to enhance the Foundry Services packaging and test roadmap and suggest options to address emerging opportunities. Executive Communication: Communicate FS market model learnings each quarter to IFS executives. Aside from the qualifications provided below, the ideal candidate shall possess the following behavioral skills: Strong Analytical Skills: Capability to analyze complex data and synthesize into useful information that supports decisions that enhance the IFS packaging portfolio. Effective Communication Skills: Proficiency in conveying detailed information clearly and concisely to diverse audiences, including internal teams and senior management, ensuring alignment and understanding. Demonstrated Ability to Plan and Manage Projects: Experience in organizing and overseeing projects from conception to completion, ensuring they are delivered on time and within scope. Ability to Work Independently in a Highly Matrixed Structure: Self-motivation and initiative to navigate and operate effectively within a complex organizational structure, collaborating with various departments and stakeholders. Presentation Skills to Senior Management (VP and Corporate VP Level): Competence in preparing and delivering presentations that communicate project status, challenges, and strategic recommendations to senior leadership, influencing decision-making. Qualifications: Bachelor’s degree with 9+ years, Master’s degree with 6+ years, or PhD with 4+ years of relevant experience in market analysis or backend semiconductor processes in Business, Computer Engineering, Electrical Engineering, Physics, Chemistry, or related field Preferred Qualifications: Extensive knowledge of industry advanced packaging technologies and trends including key suppliers across the globe. Extensive knowledge of semiconductor industry and individual company strategies Familiarity with product architecture floor plans, IP development cycles, and their dependency on package design and architecture Familiarity with power delivery, high-speed signaling, and die disaggregation architectures. Blend of both business and technical background Job Type: Experienced Hire Shift: Shift 1 (Taiwan) Primary Location: Taiwan, Taipei Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.