Advanced Packaging Engineer

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking an Advanced Packaging Engineer to join our team.    

As a successful candidate, you will be working as the Photonic/ASIC Components integrator, working with Photonics, High Speed ASIC, Laser design teams and Ranovus’ CMs to define best in class optimal assembly processes for high volume Optical Engine (Module) manufacturing, targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.

Responsibilities generally include

Design and develops complex sub-assemblies, components, and packaging as assigned. 

Develops and implements changes to product design and/or the manufacturing process to achieve efficiency, quality, and/or cost improvements by participating in new product development programs. 

Develops requirement specifications, system concepts, CAD generated using SolidWorks, detail drawings, BOM’s and budgets. Makes layouts of complex assemblies and details of parts of devices, mechanisms and structures. 

Provides customer product design engineering for economic production; may participate in meetings with customers. 

Assesses proper material, tooling, automation and equipment selection. 

Works with manufacturing to trouble-shoot problems, upgrades, retrofits, set-ups, methods development, and the development of process parameters. 

Participates in product development meetings and may make recommendations to product design changes to enhance manufacturing and assembly. 

Conduct proof of concept experiments and design other testing requirements as needed. 

Develop SOP’s operations and maintenance manuals. 

Research new technology or development tools to remain informed of current technology. 

Understanding of Lean Six Sigma tools, projects and processes and ability to incorporate these into assigned engineering projects. 

Reviews completed projects for accuracy, clarity and completeness. 

Ensures projects are compliant with all local, regional, and national regulatory requirements, codes and controls. 

Supports all company safety and quality programs and initiatives. 

May perform other duties and responsibilities as assigned. 

Required skills and experience include: 

Experience with Photonic, Laser, and ASIC components and micro-assembly;

Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes;

5-10 years of solid experience in related work;

Excellent ability to solve technical, scientific and experimental problems;

Excellent teamwork and communication skills.

Required education: 

Masters or PhD preferred in a related engineering discipline