Capillary Underfill Technology Development Module Engineer
Intel Corporation
Malaysia, Kulim
permanent
Assembly ProcessesEquipment DevelopmentManufacturing OptimizationProcess SpecificationsEquipment EvaluationMaterial SpecificationsCapability RequirementsFailover MechanismsStatistical Solutions
Job Details: Job Description: • Note: This role requires regular onsite presence to fulfill essential job responsibilities. • Develops assembly processes and/or equipment and applies novel concepts...
March 26, 2026
View Details