PICs@ICFO Strategic Initiative: Process Engineer or Research Scientist in PIC Packaging
The Institute of Photonic Sciences (ICFO)
Location not specified
Process EngineeringPhotonic PackagingDie BondingWire BondingOptical CouplingComplementary Technology IntegrationPackaging OptimizationProcess ProgrammingSupplier CollaborationMulti-disciplinary Teamwork
As part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project—two flagship programs aimed at advancing Pho...
February 9, 2026
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